Hot lamination method for a hybrid radio frequency optical memory card converting sheets into a web process

ABSTRACT

A hybrid plastic card, such as a radio frequency identification card, including at least one electronic element embedded therein and a hot lamination process for the manufacture of radio frequency cards and other cards including a micro chip embedded therein. This card has an application on the surface of security overlaminate and a laser photo optical memory strip with the CD-ROM disk technology. The process results in a card having an overall thickness in the range of 0.028 inches-0.033 inches with a surface suitable for receiving dye sublimation printing—the variation in card thickness across the surface is less than 0.0005 inches. A card manufactured in accordance with the present invention also complies with all industry standards and specifications. Also, the hot lamination process of the present invention results in an aesthetically pleasing card. The invention formed in accordance with a hot lamination process and the continuation of the present invention.

This application claims the benefit of U.S. Provisional ApplicationNos.:

APPLICATION NO. FILING DATE 60/157,054 10/01/1999 60/218,456 07/14/2000

FIELD OF INVENTION

The present invention relates to combining a radio frequency card and alaser optical memory card that conforms to industry size and performancestandards and conventions and that have a superior outer surface toknown RFID cards such that card may receive dye sublimation printing andlaser optical memory stripe.

BACKGROUND OF THE INVENTION

As the use of plastic cards for credit cards, automated teller machine(ATM) cards, identification cards, and like continues to become morewidespread, the problems associated with the use of such cardscorrespondingly increase. Credit card fraud and identification cardfraud are becoming larger problems everyday, and this fraud hasintroduced uncertainties into our systems of commerce and our securitysystems. Using easily available technology, criminals are able tomanufacture credit/debit cards, ATM cards, identification cards, and thelike having another's account code, identification code, or otherpersonal information embedded in the magnetic stripe thereof. Thus, forexample, criminals may steal hundreds or thousands of legitimate creditcard account numbers and manufacture many additional cards bearing thestolen information. These fraudulent cards are then usable by thecriminals to purchase goods and to receive cash with the legitimate cardholder and the card issuer left holding the bill. Likewise, so calleddebit cards are becoming increasingly popular. These cards have storedthereon a certain amount of value for which the card owner haspreviously paid. For example, a subway rider may purchase a card goodfor 50 fares, with one fare being deducted from the card each time theowner rides the subway. Criminals have also been able to manipulate thedata stored on these cards to defraud the merchants and others.

The ease in which criminals have been able to manufacture and ormanipulate known cards results from the existence of the easily alteredmagnetic strip storage medium used by known cards. These magneticstripes are easily programmed and reprogrammed using commonly availabletechnology. Thus, there has been found a need in the plastic cardindustry to provide a more secure plastic card that is very difficult orimpossible to fraudulently manipulate. The most likely solution to theabove-noted problems associated with known plastic cards is the RFIDcard and other cards including computer chips embedded therein ratherthan, or in addition to, a magnetic stripe. While these RFID cards andlike have been found to be successful in preventing or limiting fraud,they are more difficult and expensive to manufacture relative toordinary magnetic stripe cards. One of the biggest obstacles to the widespread manufacture and use of RFID cards has been the inability of cardmanufacturers to manufacture an RFID card that meets all industrystandards and specifications, such as those set by the InternationalStandards Organization (ISO), that are sufficiently aestheticallypleasing (wherein the embedded electronics are hidden from view), andthat have a sufficiently regular or flat surface such that one or bothsurfaces of the card may be printed on using the very popular andwidespread dye sublimation technology. Known plastic cards with computerchips and like embedded therein are too thick to work in connection withexisting card reading machinery (ATM machines, telephones, and like) andhave a surface that is too irregular to properly and consistentlyreceive dye sublimation printing. Furthermore, prior attempts tomanufacture a sufficiently thin plastic card including a computer chipembedded therein have results of a card with inferior aestheticqualities such as the ability to see the embedded computer chip throughthe plastic.

SUMMARY OF THE INVENTION

There are several lamination methods in the plastic card industry, suchas:

1. Hot and cold using a platen laminator with controlled hydraulic rampressure.

2. Hot and cold roll laminators.

3. Lamination using adhesives cured by ultra violet radiation, electronbeam radiation, or cold roll on contact adhesive.

SUMMARY OF THE INVENTION

This invention requires a combination of several lamination processes tomanufacture a Hybrid/Contactless Smart and Laser Optical Card.

The present invention is therefore directed to a hot lamination methodfor the manufacture of plastic cards including an electronic computerchip therein. The hot lamination method comprises the steps of providingfirst and second plastic core sheets, positioning at least one or moreelectronic elements between the first and second core sheets to thusform a core, and placing the core in a laminator and closing thelaminator without applying pressure to the substrates. A heat cycle isapplied to the core sheets in the laminator, thus liquefying the sheetsand the laminator ram pressure is then increased in combination with theheat. A cooling cycle is then applied to the core in the laminator,preferably with an associated increase in ram pressure, and the core isremoved from the laminator. At least one or more surface of the core isthen printed on using a printing press or similar printing apparatus toprint the cutting marks on the substrate for the purpose of cutting thecards of the finished step and also permit the cutting of the sheetsinto strips containing one or more of the electronics. At this point ofthe process the sheets can then be overlaminated with an overlaminatefilm and placed in a laminator and complete the second laminationprocess, thus giving a smoothness of 0.0005 inches and a combined cardthickness of between 0.028 inches to 0.033 inches. These sheets can thenbe cut into strips and the strips can be welded together via means ofultrasonic welding, chemical adhesive or hot melt glue, thus forming acontinuous web to be used in the process of manufacturing an opticalmemory cards. This would complete a laminated card prepared for theapplication of an optical memory stripe.

The present invention provides numerous advantages over known cardmanufacturing processes, including the formation of a plastic card withelectronic elements such as a computer chip embedded therein with apleasing aesthetic appearance, with a sufficiently smooth and regularsurface such as the card may receive a optical memory stripe and dyesublimation printing with sufficient durability and characteristics tocomply with all industry specifications and standards.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top plan view of a plastic card in accordance with thepresent invention;

FIG. 2 is a side elevational view of the card shown in FIG. 1;

FIGS. 3A-3E are top plan views of various electronic elements that maybe embedded in a card in accordance with the present invention;

FIG. 4 is an exploded, schematic view of an electronic element positionbetween two plastic core sheets to form a core;

FIG. 5 is a top plan view of a plurality of electronic elementspositioned on a sheet of plastic core stock such that they may becovered by a similar sheet of core stock;

FIG. 6 is a schematic cross-sectional view of one or more electronicelements positioned between sheets of plastic core stock;

FIG. 7 schematically illustrates a book comprising the core, as it ispositioned in a laminator apparatus;

FIG. 8 schematically illustrates the core as it is being printed onafter removal from the laminator using a printing press or similarprinting apparatus;

FIG. 9 is a cross sectional view schematically illustrating theapplication of printing marks for shear optically cutting and opticallycutting the individualized cards.

FIG. 10 is a top view of the sheet illustrating hidden electronicswithin the sheet illustrating printed marks for cutting the sheet intostrips and cutting the individual cards from the strips.

FIG. 11 is an illustration of a strip of hidden electronics in a stripcut from the sheet.

FIG. 12 is an illustration of trimmed strips welded or glued together toform a continuous strip of hidden electronics within the stripillustrating printed optical cutting marks or images.

FIG. 13 illustrates a roll of strips glued together to form a continuousweb of electronics containing images and optical cut marks. Thisillustration is the completed web ready for the application of overlayand optical laser receptive strips to complete a hybrid radio frequencyand laser optical memory card.

FIG. 14 is an illustration of a top view of a laser optical memory cardcontaining hidden radio frequency electronics.

FIG. 15. is an illustration of cross-section view of a laser opticalmemory card containing radio frequency electronics.

FIG. 16. is an illustration applying overlaminate and laser opticalmemory strip to the continuous web

FIG. 17. Illustrates a book comprising the core as it is positioned inthe laminator apparatus. The core is illustrated containing a printingon one or more of the surfaces overlaid with overlaminate film on one orboth sides of the surfaces of the core. This book is positioned betweenglossy laminating plates and the plates are positioned betweenlaminating pads. The pads are positioned between laminating trays. Thelaminating trays are positioned between the platens of the laminator,thus completing the final lamination process to produce a glossy cardwith a completed card thickness of 0.028 inches to 0.033 inches with asurface smoothness of 0.0005 inches that may receive dye sublimationprinting and also an optical memory strip with CD-ROM technology.

FIG. 18. Illustrates a continuous roll of strips affixed together ofoverlaminated printed cards containing contactless integrated circuitchips and antennas, being overlayed with optical memory strip withCD-ROM technology and cut out from this continuous roll or form.

DETAILED DESCRIPTION OF THE INVENTION

The present invention relates to a plastic card combining two differenttechnologies (1) at least one electronic element embedded therein and(2) a laser optical memory strip layered on the surface of the card. Thepresent invention also relates to a hot lamination process for themanufacture of plastic cards containing both of these elements and moreparticularly to a hot lamination process for the manufacture of plasticcards that include an electronic element, such as a computer chip or tothe electronic element embedded therein. The electronic element mayperform a wide variety of functions and take a wide variety of forms.Also, these cards will have a laser optical memory strip or CD-ROM diskapplied to the surface. Such cards will hereinafter be referred to as ahybrid radio frequency identification card (RFID) and laser memory stripcard or CD-ROM disk TECHNOLOGY. The present invention also relates to acard formed in accordance with the invention.

Referring now to FIG. 1, there can be seen a plastic RFID card 33manufactured in accordance with the present invention and including aelectronic element 20 embedded therein.

Card 33 includes an upper surface 34 and a lower surface 35 asillustrated in FIG. 2. Electronic element 20 may take a wide variety offorms and perform a variety of functions as shown in FIG. 3A-3Erespectively, electronic element 20, 20′, 20″, 20′″, 20″″ may beprovided by a micro chip 22 including a wire antenna 24 connectedthereto, a micro chip 22′ and circuit board antenna 24′, a read/writemicro chip and 22″ and a wire coil antenna 24″, or any other suitableelectronic element. These electronic elements 20, 20′, 20″, 20′″, 20″″and other insertions into plastic cards is not new, however, the presentinvention provides a new hot lamination process for manufacturingplastic cards 33 with these electronic elements 20, 20′, 20″, 20′″, 20″″embedded therein such that the cards 33 are of a superior quality.Specifically, a card in accordance with the present invention will havea variance in thickness depending on how many different applicationswill be added such as security, holographic overlaminate films andoptical memory strips or CD-ROM disks.

As shown in FIG. 4-10 one or more cards 33 in accordance with thepresent invention may be manufactured by positioning an electronicelement 20 between first and second sheets of card stock 34, 35 to forma core 33. Preferably as shown in FIG. 5-10 a plurality of cards aremanufactured simultaneously, in thus, a plurality of electronic elements20 are positioned between the first and second sheets of plastic corestock 34, 35 (only the second sheet 35 being shown in FIG. 5 forclarity). When a plurality of electronic elements 20 are positionedbetween first and second sheets of plastic core stock 34, 35, electronicelements 20 are properly positioned relative to one another such that aplurality of cards may be cut from the resulting card stock. Plasticcore sheets 34, 35 may be provided by a wide variety of plastics, thepreferred being polyvinyl chloride (PVC) having a thickness in the rangeof 0.006 inches and preferably having a combined thickness ofapproximately 0.0125 inches. Those skilled in the art will recognizethat the thickness of the plastic core electronic elements that are tobe embedded there between. Other suitable plastics that may be utilizedinclude polyester, acrylonitrile-butadiene-styrene (ABS), polycarbonateand any other suitable plastic.

Subsequent to placing one or more electronic elements 20 between thefirst and second sheets 34, 35 of plastic core stock to form a core 33,this core 33 is placed in a laminator apparatus 40 of the type wellknown in the art of plastic card manufacturing. As shown in FIG. 7,laminator 40 includes upper and lower platens 42, 44 for applying rampressure to an article positioned there between. In addition to theability to apply ram pressure, laminator 40 is preferably of the typehaving controlled platens 42, 44 that may provide both heat and chillcycles and preferably includes cycle timer to regulate cycle time. Core33 is positioned between first and second laminating plates 50, 52, oneof which is preferably matte finished to provide laminated core 33 withat least one textured outer surface. First and second laminating pads60, 62 are positioned outside of the laminating plates 50, 52 and firstand second steel plates 70, 72 are likewise positioned outside of padsof 60, 62 and the entire assembly forms a book 35 for being positionedin laminator 40 between platens 42, 44.

Once book 35 is positioned in laminator 40 as shown in FIG. 7, the firstlamination cycle is initiated by closing laminator platens 42, 44,preferably applying little or no ram pressure to book 35. A laminatorheat cycle is initiated, bringing the temperature of platens 42, 44 upto a range of 275° F. to 400° F., and most preferably up to a range of300° F. to 370° F. for a period of greater than 5 minutes, andpreferably in the range of 7 to 10 minutes. Once the heat cycle has beenapplied to the book 35 as is set forth above, the ram pressure oflaminator 40 is increased to facilitate the flow of the plastic coresheets 34, 35 so that the one or more electronic elements 20 areencapsulated thereby, and so that sheets 34, 35 form a uniform core 33(seen most clearly in FIGS. 8-10) with upper and lower surfaces 34, 35.As mentioned, the use of matte finished laminator plates 50, 52 providessurfaces 34, 35 with a slightly roughened or textured quality which willfacilitate the application of a coating thereto as is discussed below.The ram pressure applied during the heat cycle and the length of theheat cycle may vary, depending especially upon the size of sheets 34,35. For example, the cycle time may be in the range of 10-15 minutes. Inone example, a ram pump pressure of 940 pounds per square inch (p.s.i.)was applied for 10-15 minutes to form a uniform core 33, using sheets34, 35 of a size in the range of 12 inches by 24 inches to 24 inches by36 inches.

Subsequent to the above heat cycle, laminator 40 applies a chill cycleto book 35 during which time the ram pressure of the laminator 40 isincreased, preferably by approximately 25% until the platens 42, 44 havecooled to approximately 40° F. to 65° F. for approximately 10-15minutes. Core 33 may then be removed from laminator 40 for additionalprocessing.

Subsequent to the removal of core 33 from laminator 40 and asillustrated in FIG. 8, core 33 is coated on at least one of it's upperand lower surfaces 34, 35 with a layer of printing ink 36. This may beaccomplished using a wide variety of printing techniques such as offsetprinting, letterpress printing, screen printing, roller coating, sprayprinting, litho-printing, and other suitable printing techniques. Asshown in FIG. 8, core 33 is fed in the direction indicated with arrow Athrough a printing press, a lithographic printer, or a similar apparatus80. This printing step is performed to coat at least one surface 34, 35of core 33 with a layer of aesthetically pleasing ink 36. This layer ofink 36 cosmetically hides the one or more electronic elements 20 thatare embedded within core 33, and prevents these one or more electronicelements 20 from showing through the relatively thin core 33. In thismanner, the one or more electronic elements 20 encapsulated in core 33are completely hidden from view without requiring the plastic used inthe manufacture core 33 to be excessively thick.

Referring now to FIG. 9-10 the drawings illustrate layering of printingon surfaces 34 and 35. As illustrated in FIG. 10 print marks 36facilitates cutting the sheets into strips as illustrated in FIG. 11.

FIG. 11 illustrates a strip cut from the sheet of 33 FIG. 10. the stripillustrates optical trim marks 37. When ends of the strips are trimmedcutting off the ends containing optical trim marks 36 the strip can thenbe affixed together via means of ultrasonic welding or gluing joiningthe strips together 38 as illustrated in FIG. 12.

FIGS. 10, 11 and 12 illustrates sheets made into strips with optical cutmarks.

FIG. 13 illustrates a roll 39 of continuous strips affixed together.This roll of continuous strips can then be applied as a substrate in theuse of manufacturing laser optical memory cards as using CD-ROM disktechnology. This would then produce a hybrid card using two extremelyhigh noncounterfeitable technologies as illustrated in FIG. 14.

FIG. 14 illustrates a top view of a single card containing a RFIDcontactless smart chip and electronics a laser photo optic memory strip45 with CD-ROM disk technology. This card is then ready for encoding onthe optical memory strip and writing into the smart chip 20 andreceiving dye sublimation printing and encoding a magnetic strip ifused.

FIG. 15 illustrates a side cross-section of a single card containing a“RFID contactless smart chip and a cross-section of the layering of ink36 and security overlaminate and laser photo optical memory strip 45with CD-ROM disk technology. FIG. 15 also illustrates overlaminate film41, layered over printing 36 of FIG. 9 and FIG. 10.

FIG. 16 illustrates a roll of electronics embedded in a core stock 33printed 36-37 and layered with security holographic overlaminate 41 viaelectron beam or ultra violet photo adhesive or cold contact glue 43 andlayered with a roll strip of laser photo optical memory or CD-ROM disktechnology 45. FIG. 16 also illustrates the card 33 being cut from thecontinuous form of the hybrid cards as illustrated top view of FIG. 14.

FIG. 17 illustrates 80 of FIG. 9 placed in laminator 40 layered betweenoverlaminate film 41. 41 layered between glossy laminating plates 81 and82. Laminating plates 81 and 82 are layered between laminating pads 60and 62. Pads 60 and 62 are layered between trays 70 and 72. FIGS. 72,62, 82, 41, 81, 60, and 70 makeup a book 90. Book 90 is placed betweenplatens 44, 42 of laminator 40. A normal laminating cycle of FIG. 17 isapplied to book 90 with minimal ram pressure of the laminator 40. At thestart of the heat cycle approximately 50 pounds PSI increasing to 250lbs. PSI of pressure through the heat cycle of 285° F.-300° F. At thestart of the chill cycle the ram pressure is increased approximately 20%after the chill cycle is complete between 45° F.-65° F. the pressure isreleased and the book is removed from the laminator.

FIG. 18 illustrates a roll of laminated cards being overlayed withoptical memory strip 45, and cards being cut 46, from a continuoussubstrate. FIG. 13 illustrates a roll 39 of continuous strips affixedtogether. This roll of continuous strips can then be applied as asubstrate in the use of manufacturing laser optical memory cards asusing CD-ROM disk technology. This would then produce a hybrid cardusing two extremely high noncounterfeitable technologies as illustratedin FIG. 14.

FIG. 14 illustrates a top view of a single card containing a RFIDcontactless smart chip and electronics a laser photo optic memory strip45 with CD-ROM disk technology. This card is then ready for encoding onthe optical memory strip and writing into the smart chip 20 andreceiving dye sublimation printing and encoding a magnetic strip ifused.

FIG. 15 illustrates a side cross-section of a single card containing aRFID contactless smart chip and a cross-section of the layering of ink36 and security overlaminate and laser photo optical memory strip 45with CD-ROM disk technology.

FIG. 16 illustrates a roll of electronics embedded in a core stock 33printed 36-37 and layered with security holographic overlaminate 41 viaelectron beam or ultra violet photo adhesive or cold contact glue 43 andlayered with a roll strip of laser photo optical memory or CD-ROM disktechnology 45. FIG. 16 also illustrates the card 33 being cut from thecontinuous form of the hybrid cards as illustrated top view of FIG. 14.

What is claimed is:
 1. A hot lamination process with a manufacture of ahybrid plastic card, said process comprising the steps of: (a) providingfirst and second plastic core sheets; (b) positioning at least oneelectronic element between said first and second plastic core sheets toform a layered core; (c) positioning said core in a laminator apparatus,heating said core in the laminator, thereafter applying ram pressure tosaid core such that said at least one electronic element is encapsulatedin said core, and thereafter cooling said core in conjunction withlaminator ram pressure being applied to said core, said core includingupper and lower surfaces; (d) printing on at least one of said upper andlower surfaces of said core such that a layer of ink is applied to saidat least one upper and lower surface of said core whereby shear cuttingmarks are applied and also optical single card cutting marks are appliedon at least one surface of said core; (e) cutting of said core at saidprinting marks into said strips containing RFID electronics; (f) cuttingshear cutting marks from both ends of said strips of core stock,containing RFID electronics; (g) affixing said core strips containingRFID electronics end to end via means of ultrasonic welding, adhesivegluing.
 2. The hot lamination process as recited in claim 1, whereinsaid step (c) positioning said core in a laminator apparatus is carriedout by positioning said core between first and second laminating plates,at least one of said first and second laminating plates having a mattefinish to provide at least one of said upper and lower core surfaceswith a correspondingly textured surface.
 3. The hot lamination processas recited in claim 2, wherein each of said first and second laminatingplates includes matte finish to provide both of said upper and lowersurfaces of said core with a correspondingly textured surface.
 4. Thehot lamination process as recited in claim 1, wherein said first andsecond plastic core sheets are made from a material selected from thegroup consisting of polyvinyl chloride, polyester, andacrylonitrile-butadiene-styrene or polycarbonate wherein each of saidsheet has a thickness in the range of 0.006 inches to 0.012 inches. 5.The hot lamination process as recited in claim 4, wherein said first andsecond plastic core sheets have a combined thickness of approximately0.0125 inches.
 6. The hot lamination process as recited in claim 1,wherein said step (c) is carried out by: (c1) constructing a first bookincluding said core and at least first and second laminating platesrespectively adjacent to said upper and lower surfaces of said core;(c2) positioning said book in said laminator apparatus; (c3) closingsaid laminator apparatus and heating said core for a first predeterminedamount of time without applying essentially any laminator ram pressureto said core; (c4) increasing said laminator ram pressure following thepassage of said first predetermined amount of time to apply pressure tosaid core in conjunction with said heating of said core; and, (c5)cooling said core in said laminator in conjunction with laminator rampressure being applied to said core.
 7. The hot lamination process asrecited in claim 6, wherein said step (c5) is carried out with a rampressure that is greater than the ram pressure utilized in step (c4). 8.The hot lamination process as recited in claim 7, wherein the laminatorpressure utilized in step (c5) is at least approximately 25% greaterthan the ram pressure utilized in step (c4).
 9. The hot laminationprocess as recited in step 6, wherein at least one of said first andsecond laminating plates is a matte finished laminating plate to provideat least one of said upper and lower surfaces of said core with acorresponding matte finish.
 10. The hot lamination process as recited inclaim 9, wherein both of said first and second laminating plates arematte finished laminating plates to provide each of said upper and lowersurfaces of said core with a corresponding matte finish.
 11. The hotlamination process as recited in claim 6, wherein said step (c3) iscarried out by heating said core to a temperature in a range of 300° F.to 370° F. for at least 5 to 10 minutes.
 12. The hot lamination processas recited in claim 11, wherein said step (c4) is carried out byincreasing said laminator ram pressure to a pressure approximately in arange of 700 p.s.i. to 1000 p.s.i. for at least 10 minutes.
 13. The hotlamination process as recited in claim 6 wherein said core sheetsfurther include trim marks, and further comprise the step of cuttingsaid core sheets into strips at a location of said trim marks.
 14. Thehot lamination process of claim 13 comprising the further steps ofaffixing said strips together via means of ultrasonic welding, gluing toform a continuous form wound onto a roll.
 15. The hot lamination processof claim 14 comprising the further steps of: applying a securityoverlaminated file to said rolled core sheets; applying a laser photooptical memory strip with CD-ROM technology and cutting said rolled coresheets into individual cards.
 16. The hot lamination process as recitedin claim 1, wherein said step (d) is carried out utilizing a printingpress.
 17. The hot lamination process as recited in claim 1, whereinsaid step (d) is carried out utilizing a coating technique selected froma group consisting of silk screen printing, offset printing, letterpressprinting, screen printing, roller coating, spray printing, andlitho-printing.
 18. The hot laminated process as recited in claim 1,wherein the at least one electronic element is a micro chip and anassociated wire antenna.
 19. The hot lamination process as recited inclaim 1, wherein the at least one electronic element is a micro chip andan associated circuit board antenna.
 20. The hot lamination process asrecited in claim 1, wherein said at least one electronic element is aread write integrated chip and associated antenna.